Career Center

Key Qualifications

•             3+ years of experience in factory test and diagnostics development

•             Knowledge of Motherboard architecture and related subsystems such as CPU, Memory controller, Platform controller hub, BMC, DC-SCM, NVMe, HBA, HDD, OOB and OCP networking,

•             Linux systems engineering: Installing RHEL/Ubuntu, compiling custom drivers into the kernel. Internal knowledge of LinuxOS, file system structure, daemons, systemd, dmesg, SEL logs.

•             Proficient in Unix Shell (Bash), and Python programming. Good at RegExp using sed, awk, grep, gnu-utils, etc.

•             Experience with stress testing utilities, stressapp, stress-ng, iperf3, fio, memtester, etc.

•             Strong networking background and understanding of TCP/IP stack, 1GbE OOB Ethernet, 100GbE QSFP NICs and Switchgear. Arista EOS or Cisco IOS / Nexxus operating systems

•             SMBIOS, DMI, Ipmitool, bee-mc, UEFI shell and BIOS settings.

•             Experience programming FRU EEPROMs, contents and format

•             Functional understanding of open/short and in circuit testing

•             Ability to troubleshoot test hardware

Description of Responsibilities

•             Help create as well as audit and approve Functional Test Plans and Burn-in stress testing sequences

•             Validate in the lab, then deliver firmware updates to the production floor.

•             Help design and improve production line layout and assembly stations and process

•             Manage production in the factory from prototype through EVT, DVT, PVT, Ramp and MP phases

•             Problem solve F/A reports and improve diags to maintain >98% yield rate on high volume production lines through continuous improvement and sustaining engineering efforts.

•             Monitor and enforce test equipment calibration, ESD compliance, and consumable commodities (drives / cables / DIMMs, CPUs, etc.) maintenance policies.

•             Co-develop manufacturing instructions with ODM detailing assembly and test processes from flash programming through testing, labeling and final packaging

Requires travel to factories in Asia and North America (~25% of the time